Taiwanese chipmaker MediaTek has announced the launch of the MediaTek Helio P10, a high-performance, high-value SoC aimed at offering slim form-factor smartphones with flagship features. The Helio P10 showcases a 2 GHz, True Octa-core 64-bit Cortex-A53 CPU and a 700MHz, dual-core 64-bit Mali-T860 GPU. [related-post] The Helio P10 will be available to manufacturers by Q3 2015 and is expected to be in consumer products by late 2015. The new Helio P family aims to integrate into a high-value chipset, premium features such as high-performance modem technology; the world’s first TrueBright ISP engine for ultra-sensitive RWWB; and, MiraVision 2.0, for top-tier display experiences. The features available in the P series include several of MediaTek’s premier technologies like WorldMode LTE Cat-6, supporting 2x20 carrier aggregation with 300/50Mbps data speed; MediaTek’s advanced task scheduling algorithm, CorePilot, which optimises the P10’s heterogeneous computing architecture by sending workloads to the most suitable computing device. “The P series will provide OEM smartphone makers with greater design flexibility to meet consumer demands for slim form-factors, which provide dynamic multimedia experiences,” said Jeffrey Ju, Senior Vice President of MediaTek. “The P10 enables state-of-the-art mobile computing and multimedia features all while balancing performance and battery life.” The Helio P10 is the first to use TSMC’s 28nm HPC+ process, which allows for reduced processor power consumption. It can save up to 30 per cent more power (depending of usage scenarios), compared to existing smartphone SoCs manufactured using the 28 HPC process.
